Wafering Blades have a high concentration metal matrix diamond rim. Excellent cutting rate and a long lifetime is achieved as the bond breaks down to expose new cutting facets. Designed for use on very hard or brittle materials
Wafering Blades have a high concentration metal matrix diamond rim. Excellent cutting rate and a long lifetime is achieved as the bond breaks down to expose new cutting facets. Designed for use on very hard or brittle materials
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